Gate mark too large

The residual mark at the gate is obvious and affects appearance. When this defect appears in products of Process No. 4, it is usually related to a specific process parameter range or equipment state. If it continues to appear, it will directly affect the product qualification rate and production rhythm, increasing material loss and rework costs. Timely diagnosis and elimination is a basic requirement for ensuring stable production.

1. Mold design factors: gate size too large, improper gate position, unclean gate break-off, incomplete curing of material at the gate. 2. Feeding factor: The volume of the feeding chamber, the feeding amount and the preheating state of the material directly determine the transfer pressure and filling effect, and are key variables unique to transfer molding.

1. Process parameter optimization and adjustment: reduce the gate size, optimize the gate position, improve the gate break-off design, ensure sufficient curing at the gate. 2. Systematic troubleshooting method: Troubleshooting of transfer molding problems follows the order of 'runner -> feeding -> parameters -> mold'. First check whether the runners and gates are blocked or worn, then verify the feeding amount and material preheating, then adjust the transfer pressure and speed, and finally check the mold venting and temperature uniformity. 3. Preventive management: Establish standardized process parameter cards and quality control limits for each set of mold/product, and regularly conduct process capability index (CPK) evaluations. For recurring problems, use fishbone diagrams or 5Why analysis to trace the root cause, and solidify the countermeasures as PFMEA control points.

This problem is a typical manifestation of gate mark too large in transfer molding; the core of the solution lies in the rational design of the runner and gate system, the effective transmission of transfer pressure, and the uniform control of mold temperature. It is recommended to start troubleshooting from the runner system and transfer parameters.