Molds & Tooling
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PCABS mold temperature and internal stress
Problembeschreibung
【Problem Phenomenon】PC/ABS mold temperature too low, parts have large internal stress, high risk of cracking and warpage
Ursachenanalyse
Mold temperature 60-80℃ recommended: high mold temperature 80℃ improves surface and reduces internal stress; low mold temperature 60℃ shortens the cycle but increases warpage risk; the PC component is sensitive to stress
Lösung
For appearance and stress-sensitive parts, take mold temperature 75-80℃; for cycle-priority parts, 60-70℃; uniformize cavity temperature difference; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Wichtigste Erkenntnis
PC/ABS mold temperature 60-80℃, stress parts take the upper limit; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a troubleshooting reference for similar problems later
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