Molds & Tooling
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PCABS Shrinkage Voids and Dents
Problembeschreibung
PC/ABS shrinkage voids and dents are caused by insufficient mold filling, comprehensively adjusted by temperature, holding pressure, and gate.
Ursachenanalyse
PC/ABS shrinkage voids are caused by insufficient mold filling; mold temperature, material temperature, and flow; holding pressure time, pressure, and speed; gate size; runner heating; comprehensive factors.
Lösung
①Increase mold and material temperature; ②extend holding pressure time; ③increase injection pressure and speed; ④enlarge gate size; ⑤heat gates and runners.; after adjustment, continuously sample to verify the effect, and resume mass production after confirming stability
Wichtigste Erkenntnis
Systematic adjustment of PCABS shrinkage voids is the standard path; temperature, holding pressure, and gate are equally important; runner heating is a refined means.; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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