Molds & Tooling
2 Aufrufe
PC mold temperature 80-120
Problembeschreibung
【Problem Phenomenon】PC mold temperature too low causes large internal stress and easy cracking, too high lengthens the cycle
Ursachenanalyse
PC mold temperature 80-120℃: high mold temperature reduces internal stress and improves weld lines and surface but extends the cycle; low mold temperature shortens the cycle but internal stress is large and cracking risk is high
Lösung
Stress-sensitive parts mold temperature 100-120℃; conventional parts 80-100℃; uniform cavity temperature difference;After adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Wichtigste Erkenntnis
PC mold temperature 80-120℃, stress parts take the upper limit to prevent cracking;After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence;Include this case in the defect archive as a reference for troubleshooting similar problems in the future
War das hilfreich?
0 Personen fanden dies hilfreich
Vielen Dank für Ihr Feedback!