Menu
Materials Machinery
Insights
Articles Videos Problem & Solution
About
About Chembull Media Partners
Contact Us
Language
EnglishالعربيةPortuguêsEspañolDeutschTürkçe한국어
Back to Problem & Solution
Molds & Tooling 1 views

PC mold temperature 80-120

Problem Phenomenon
【Problem Phenomenon】PC mold temperature too low causes large internal stress and easy cracking, too high lengthens the cycle
Cause Analysis
PC mold temperature 80-120℃: high mold temperature reduces internal stress and improves weld lines and surface but extends the cycle; low mold temperature shortens the cycle but internal stress is large and cracking risk is high
Solution
Stress-sensitive parts mold temperature 100-120℃; conventional parts 80-100℃; uniform cavity temperature difference;After adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Key Takeaway
PC mold temperature 80-120℃, stress parts take the upper limit to prevent cracking;After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence;Include this case in the defect archive as a reference for troubleshooting similar problems in the future
mold temperatureinternal stresscrackingcycle

Was this helpful?

0 people found this helpful

ChemAI