Molding Process
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MP compression molding incomplete curing
Problembeschreibung
MP melamine resin compression molded products curing degree <90%, surface has bubbles and soft spots
Ursachenanalyse
curing temperature <150°C, low; curing time insufficient <3min; pressure insufficient <10MPa
Lösung
1) raise curing temperature to 150-170°C; 2) extend curing time to 5-8min; 3) compression pressure 15-20MPa
Wichtigste Erkenntnis
MP thermoset curing requires the three parameters of temperature, time and pressure to be sufficient
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