Injection Molding
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PC/ABS '2079851475616104452 warpage
Problembeschreibung
Large flat PC/ABS products warp and deform after demolding.
Ursachenanalyse
The shrinkage difference between amorphous PC and semi-crystalline ABS, plus uneven mold temperature, causes warpage.
Lösung
Increase mold temperature 60-80°C with uniform distribution; uniform wall thickness; optimize gates.
Wichtigste Erkenntnis
PC/ABS warpage is jointly caused by the shrinkage difference of the two components and uneven cooling.
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