Injection Molding
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PC/ABS '2079851475616104452 warpage
Fenómeno del problema
Large flat PC/ABS products warp and deform after demolding.
Análisis de la causa
The shrinkage difference between amorphous PC and semi-crystalline ABS, plus uneven mold temperature, causes warpage.
Solución
Increase mold temperature 60-80°C with uniform distribution; uniform wall thickness; optimize gates.
Conclusión clave
PC/ABS warpage is jointly caused by the shrinkage difference of the two components and uneven cooling.
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