Injection Molding
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High Internal Stress in PC Injection-Molded Parts
Problembeschreibung
The internal stress level of PC products is high, and the polarized light stress test fails.
Ursachenanalyse
Fast cooling and low mold temperature freeze the molecular chain orientation, and the stress release is insufficient.
Lösung
Increase the mold temperature to 90-120°C; extend the cooling time; anneal at 120°C/1-2h.
Wichtigste Erkenntnis
PC internal stress is the precursor of performance deterioration and cracking.
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