Injection Molding
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High Internal Stress in PC Injection-Molded Parts
Problem Phenomenon
The internal stress level of PC products is high, and the polarized light stress test fails.
Cause Analysis
Fast cooling and low mold temperature freeze the molecular chain orientation, and the stress release is insufficient.
Solution
Increase the mold temperature to 90-120°C; extend the cooling time; anneal at 120°C/1-2h.
Key Takeaway
PC internal stress is the precursor of performance deterioration and cracking.
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