Injection Molding
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High Internal Stress in PC Injection-Molded Parts
Fenómeno do problema
The internal stress level of PC products is high, and the polarized light stress test fails.
Análise das causas
Fast cooling and low mold temperature freeze the molecular chain orientation, and the stress release is insufficient.
Solução
Increase the mold temperature to 90-120°C; extend the cooling time; anneal at 120°C/1-2h.
Conclusão principal
PC internal stress is the precursor of performance deterioration and cracking.
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