Molding Process
3 Aufrufe
PAI insufficient post-curing, insufficient performance
Problembeschreibung
Without post-curing, the PAI heat deflection temperature and strength are far lower than expected
Ursachenanalyse
The imidization reaction of PAI is not completed during molding; the post-curing temperature or time is insufficient
Lösung
Post-cure according to the 260°C specification with stepwise heating and curing, up to 260°C and hold for a sufficient time
Wichtigste Erkenntnis
Post-curing is the decisive step for achieving PAI performance
War das hilfreich?
0 Personen fanden dies hilfreich
Vielen Dank für Ihr Feedback!