Molding Process
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PAI insufficient post-curing, insufficient performance
Fenómeno del problema
Without post-curing, the PAI heat deflection temperature and strength are far lower than expected
Análisis de la causa
The imidization reaction of PAI is not completed during molding; the post-curing temperature or time is insufficient
Solución
Post-cure according to the 260°C specification with stepwise heating and curing, up to 260°C and hold for a sufficient time
Conclusión clave
Post-curing is the decisive step for achieving PAI performance
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