Molding Process
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Solvent residue in wet-process PI film
Fenómeno del problema
Residual solvent in PI films prepared by the chemical imidization method
Análisis de la causa
Residue of chemical imidization reagents; insufficient washing
Solución
Extend washing time; increase drying temperature; use advanced methods such as supercritical CO₂ extraction
Conclusión clave
Solvent residue affects the electrical and thermal properties of PI films
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