Molding Process
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Product bubbles during imidization
Fenómeno del problema
A large number of bubbles are generated during thermal imidization, causing defects in PI films or products
Análisis de la causa
Water produced during imidization (condensation byproduct) has no time to escape; heating rate too fast, water vapor bursts
Solución
Use step heating (such as holding at 100/200/300°C for 1h each); control the film thickness not to be too thick; heat slowly in an inert atmosphere
Conclusión clave
Controlling water escape during imidization is the key to PI preparation
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