Molding Process
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Product bubbles during imidization
Problem Phenomenon
A large number of bubbles are generated during thermal imidization, causing defects in PI films or products
Cause Analysis
Water produced during imidization (condensation byproduct) has no time to escape; heating rate too fast, water vapor bursts
Solution
Use step heating (such as holding at 100/200/300°C for 1h each); control the film thickness not to be too thick; heat slowly in an inert atmosphere
Key Takeaway
Controlling water escape during imidization is the key to PI preparation
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