Molding Process
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COC Microfluidic Chip Poor Bonding
Fenómeno del problema
After thermocompression bonding, COC microfluidic chips show liquid leakage, channel collapse or insufficient bonding strength, and the dimensional deformation of microchannels exceeds tolerance.
Análisis de la causa
When the bonding temperature is close to Tg, the channel top softens and collapses; if the temperature is insufficient, interfacial diffusion is inadequate and the bonding force is low; the pressure and time window is narrow; surface cleanliness affects molecular-level fitting.
Solución
①Precisely control the bonding temperature within a narrow window near Tg; ②optimize bonding pressure and time by orthogonal tests; ③plasma cleaning and activation before bonding; ④dual inspection of air tightness and strength after bonding.
Conclusión clave
COC microfluidic bonding is a precise balance of temperature, pressure and cleanliness; the narrow window requires high temperature control accuracy of the equipment; each batch of bonding parameters needs to be sampled by destructive testing.
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