Extrusion & Post
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COC In-mold Decoration Delamination
Fenómeno del problema
In COC in-mold decoration (IMD) products, the decorative film delaminates from the substrate and the edges warp, and the pattern falls off after the friction resistance test.
Análisis de la causa
COC's low surface polarity results in weak bonding with the ink layer of the decorative film; melt filling shear impacts the film layer adhesion; mismatched mold temperature affects the fusion of the film-substrate interface.; During on-site troubleshooting, verify item by item according to this mechanism to avoid blindly adjusting the machine based only on experience
Solución
①Select an ink and substrate system of the decorative film that matches COC; ②reduce the filling front shear to protect the film layer; ③increase mold temperature to promote interfacial fusion; ④dual verification of bonding force and wear resistance.
Conclusión clave
The success or failure of COC in-mold decoration lies in the matching of the film material system; IMD of low surface energy materials requires dedicated schemes; interface verification is more reliable than appearance inspection.; After confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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