Material Drying
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PBT Connector Application
Fenómeno del problema
PBT connectors with thin walls and multiple cavities are difficult to fill, or blister and deform after reflow soldering
Análisis de la causa
Connector thin-walling requires high-flow grades; after moisture absorption, the water vaporizes and blisters during reflow soldering; the warpage of glass fiber reinforced grades affects terminal coplanarity; during on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based only on experience
Solución
①Select high-flow grades for thin-wall connectors; ②For reflow soldering scenarios strictly dry and select heat-resistant grades; ③Low-warpage grades ensure coplanarity; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability
Conclusión clave
PBT connectors are a triple test of fluidity, heat resistance, and flatness; grade selection determines success or failure; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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