Material Drying
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PBT Connector Application
Problem Phenomenon
PBT connectors with thin walls and multiple cavities are difficult to fill, or blister and deform after reflow soldering
Cause Analysis
Connector thin-walling requires high-flow grades; after moisture absorption, the water vaporizes and blisters during reflow soldering; the warpage of glass fiber reinforced grades affects terminal coplanarity; during on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based only on experience
Solution
①Select high-flow grades for thin-wall connectors; ②For reflow soldering scenarios strictly dry and select heat-resistant grades; ③Low-warpage grades ensure coplanarity; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability
Key Takeaway
PBT connectors are a triple test of fluidity, heat resistance, and flatness; grade selection determines success or failure; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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