Injection Molding
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PCABS Warpage and Deformation
Fenómeno del problema
PC/ABS warpage is caused by improper design, gate, and processing conditions, with internal stress and uneven shrinkage.
Análisis de la causa
PC/ABS warpage and deformation are usually caused by unreasonable part design, improper gate position, and inappropriate '2079851475616104452 processing conditions; internal stress inside; uneven or excessive shrinkage; thin-walled, narrow, long panels shrink differently in transverse and longitudinal directions after high and low temperature cycles.
Solución
①Design rationality review; ②gate position optimization; ③processing condition adjustment; ④internal stress management; ⑤high and low temperature cycle verification.; after adjustment, continuously sample to verify the effect, and resume mass production after confirming stability
Conclusión clave
The three elements of PCABS warpage are design, gate, and process; internal stress and shrinkage are the mechanism; cycle verification exposes problems.; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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