Molds & Tooling
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PC amorphous management logic
Fenómeno del problema
【Problem Phenomenon】Managing PC process with crystalline material thinking, parameters misplaced
Análisis de la causa
PC amorphous: no crystalline melting point, uniform shrinkage 0.5-0.7%, mold temperature affects surface stress rather than crystallinity；During on-site troubleshooting, verify item by item according to this mechanism, and avoid blindly adjusting the machine based solely on experience
Solución
Set process according to amorphous logic; mold temperature serves surface stress; uniform shrinkage compensation；After adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability；Change only one variable at a time and record parameter changes to facilitate locating effective measures
Conclusión clave
PC amorphous material, mold temperature manages surface stress；After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence；Include this case in the defect archive as a reference for troubleshooting similar problems in the future
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