Molds & Tooling
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PC Warpage and Deformation
Fenómeno del problema
[Problem Phenomenon] PC flat panel frame parts warp, causing poor assembly
Análisis de la causa
Uneven cooling, low mold temperature and internal stress release cause it; amorphous warpage mostly originates from process and structure; when troubleshooting on site, verify each item according to this mechanism one by one, and avoid blindly adjusting the machine based on experience alone
Solución
Uniform mold temperature at the upper limit; symmetrical holding pressure; uniform wall thickness; annealing to relieve stress; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability; change only one variable at a time and record parameter changes, so as to locate effective measures
Conclusión clave
For PC warpage, check mold temperature uniformity, with annealing to relieve stress as an aid; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
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