Molds & Tooling
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PSU Mold Sticking and Demolding Management
Fenómeno del problema
[Problem Phenomenon] PSU products stick to the mold and get pulled and damaged; release agent effect is unstable
Análisis de la causa
PSU adhesion to the cavity and rigidity make demolding force large; raising mold temperature or applying release agent on the surface can both improve demolding; after long-term high-temperature operation, mold surface wear aggravates sticking
Solución
Appropriately raise mold temperature to improve demolding; select high-temperature resistant release agent applied thinly; regularly inspect mold surface wear and repair and harden; after adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
Conclusión clave
PSU sticking relies on the dual means of hot mold plus release agent; mold wear needs regular repair; After confirming effectiveness, solidify the parameters and practices into the work instructions to prevent recurrence; Include this case in the defect archive as a reference for troubleshooting similar problems in the future
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