Injection Molding
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Severe Internal Stress Concentration of CMC
Fenómeno del problema
Internal stress of CMC products >15MPa causes cracking during storage
Análisis de la causa
Injection speed is too fast and orientation stress is large; uneven cooling freezes thermal stress; improper gate position concentrates flow orientation
Solución
1)Reduce injection speed to reduce orientation; 2)Uniform mold temperature to reduce thermal stress; 3)Anneal at 80°C/4h to release stress; 4)Optimize gate position
Conclusión clave
Internal stress is caused by fast injection and uneven cooling; speed reduction, uniform cooling and annealing are the key
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