Injection Molding
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Analysis and Solution of mold temperature of PAK in injection of electronic components
Fenómeno del problema
When producing electronic components by injection, PAK shows abnormal performance related to mold temperature.
Análisis de la causa
The main reason is that parameter control is not strict in the aspect of mold temperature, leading to unstable processing.
Solución
Comprehensively solve the mold temperature problem from the perspective of formulation optimization.
Conclusión clave
The mold temperature control of PAK is the key link to ensure processing quality.
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