Injection Molding
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Analysis and Solution of mold temperature of PAK in injection of electronic components
Problem Phenomenon
When producing electronic components by injection, PAK shows abnormal performance related to mold temperature.
Cause Analysis
The main reason is that parameter control is not strict in the aspect of mold temperature, leading to unstable processing.
Solution
Comprehensively solve the mold temperature problem from the perspective of formulation optimization.
Key Takeaway
The mold temperature control of PAK is the key link to ensure processing quality.
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