Material Analysis
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Problem of bubble of high-temperature resistant masterbatch in PEEK applications
Fenómeno del problema
High-temperature resistant masterbatch shows bubble during high-temperature processing of PEEK.
Análisis de la causa
Improper matching between carrier resin and matrix.
Solución
Solve by adjusting the masterbatch concentration.
Conclusión clave
The key of high-temperature resistant masterbatch lies in carrier resin matching.
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