Molds & Tooling
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Warpage Deformation of PC Products
Fenómeno del problema
Large flat PC products warp after demolding.
Análisis de la causa
Uneven mold temperature causes shrinkage differences; the orientation stress of high-modulus PC is released; the wall thickness is uneven; the cooling is uneven.
Solución
Increase the mold temperature to 80-120°C with uniform distribution; make the wall thickness uniform; optimize the gate position and cooling.
Conclusión clave
PC warpage is the result of internal stress and uneven cooling.
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