Processing Machinery
3 조회수
Surface Skinning of PS Foam Board
문제 현상
The surface skin of the board is too thick or too thin.
원인 분석
Die temperature and cooling conditions determine skin thickness; process fluctuations cause skinning to go out of control.; During on-site troubleshooting, verify item by item according to this mechanism, avoiding blindly adjusting the machine based solely on experience
해결 방법
①Stabilize die temperature; ②Control cooling; ③Match haul-off speed; ④Inspect skin condition.; After adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
핵심 요약
Skin control affects board performance and post-processing; temperature is the main control parameter.; After confirming effectiveness, solidify the parameters and practices into the work instructions to prevent recurrence; Include this case in the defect archive as a reference for troubleshooting similar problems in the future
이 정보가 도움이 되었나요?
0 명이 도움이 되었다고 합니다
의견 주셔서 감사합니다!