Processing Machinery
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Surface Skinning of PS Foam Board
Fenómeno del problema
The surface skin of the board is too thick or too thin.
Análisis de la causa
Die temperature and cooling conditions determine skin thickness; process fluctuations cause skinning to go out of control.; During on-site troubleshooting, verify item by item according to this mechanism, avoiding blindly adjusting the machine based solely on experience
Solución
①Stabilize die temperature; ②Control cooling; ③Match haul-off speed; ④Inspect skin condition.; After adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
Conclusión clave
Skin control affects board performance and post-processing; temperature is the main control parameter.; After confirming effectiveness, solidify the parameters and practices into the work instructions to prevent recurrence; Include this case in the defect archive as a reference for troubleshooting similar problems in the future
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