Processing Machinery
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Surface Skinning of PS Foam Board
Problem Phenomenon
The surface skin of the board is too thick or too thin.
Cause Analysis
Die temperature and cooling conditions determine skin thickness; process fluctuations cause skinning to go out of control.; During on-site troubleshooting, verify item by item according to this mechanism, avoiding blindly adjusting the machine based solely on experience
Solution
①Stabilize die temperature; ②Control cooling; ③Match haul-off speed; ④Inspect skin condition.; After adjustment, continuously sample to verify the effect, and resume mass production only after confirming stability
Key Takeaway
Skin control affects board performance and post-processing; temperature is the main control parameter.; After confirming effectiveness, solidify the parameters and practices into the work instructions to prevent recurrence; Include this case in the defect archive as a reference for troubleshooting similar problems in the future
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