Extrusion & Post
10 조회수
CEF surface dense pockmarks
문제 현상
Dense pockmarks of 0.1-0.3mm appear on the surface of the CEF product, affecting the appearance and coating adhesion
원인 분석
The raw material contains impurity particles >0.05%; the mold cavity surface is damaged or has corrosion pits
해결 방법
1) Replace with pure raw material with impurities <0.01%; 2) Repair and polish the mold cavity to Ra<0.2μm; 3) Filter the raw material to remove particles
핵심 요약
Pockmarks are caused by raw material impurities and mold damage; pure raw materials and mold maintenance are the key
이 정보가 도움이 되었나요?
0 명이 도움이 되었다고 합니다
의견 주셔서 감사합니다!