Extrusion & Post
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CEF surface dense pockmarks
Problem Phenomenon
Dense pockmarks of 0.1-0.3mm appear on the surface of the CEF product, affecting the appearance and coating adhesion
Cause Analysis
The raw material contains impurity particles >0.05%; the mold cavity surface is damaged or has corrosion pits
Solution
1) Replace with pure raw material with impurities <0.01%; 2) Repair and polish the mold cavity to Ra<0.2μm; 3) Filter the raw material to remove particles
Key Takeaway
Pockmarks are caused by raw material impurities and mold damage; pure raw materials and mold maintenance are the key
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