Material Analysis
14 조회수
Analysis and solution of carrier resin temperature resistance of High-temp MB in PA electronic parts
문제 현상
High-temp MB shows abnormal performance related to carrier resin temperature resistance when producing electronic parts with PA.
원인 분석
The main cause is excessive parameter fluctuations in terms of carrier resin temperature resistance leading to unstable processing.
해결 방법
Comprehensively solve the carrier resin temperature resistance problem from the perspective of raw material control.
핵심 요약
Control of carrier resin temperature resistance of High-temp MB is the key link to ensure processing quality.
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