Material Analysis
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Analysis and solution of carrier resin temperature resistance of High-temp MB in PA electronic parts
Fenómeno do problema
High-temp MB shows abnormal performance related to carrier resin temperature resistance when producing electronic parts with PA.
Análise das causas
The main cause is excessive parameter fluctuations in terms of carrier resin temperature resistance leading to unstable processing.
Solução
Comprehensively solve the carrier resin temperature resistance problem from the perspective of raw material control.
Conclusão principal
Control of carrier resin temperature resistance of High-temp MB is the key link to ensure processing quality.
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