Material Analysis
16 مشاهدة
Analysis and solution of carrier resin temperature resistance of High-temp MB in PA electronic parts
ظاهرة المشكلة
High-temp MB shows abnormal performance related to carrier resin temperature resistance when producing electronic parts with PA.
تحليل الأسباب
The main cause is excessive parameter fluctuations in terms of carrier resin temperature resistance leading to unstable processing.
الحل
Comprehensively solve the carrier resin temperature resistance problem from the perspective of raw material control.
الخلاصة الأساسية
Control of carrier resin temperature resistance of High-temp MB is the key link to ensure processing quality.
هل كان هذا مفيدًا؟
0 شخص وجدوا هذا مفيدًا
شكرًا لك على ملاحظاتك!