Material Drying
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Control of LCP Regrind Usage Ratio
Problem Phenomenon
【Problem Phenomenon】After blending in regrind, the soldering blistering rate of LCP products rises and strength decreases
Cause Analysis
After regrind has experienced thermal history, its molecular weight decreases and it may absorb moisture; when the ratio is too high, both soldering heat resistance and strength decrease; LCP regrind control is a common topic in mass production of high-temperature soldered parts
Solution
Strictly control the regrind ratio for soldered parts and verify the oil bath blistering rate; dry regrind separately before use; establish regrind batch traceability and performance sampling inspection; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Key Takeaway
LCP regrind must be re-dried and its ratio limited; soldered parts require strict verification; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a troubleshooting reference for subsequent similar problems
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