Thermoforming
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The blistering problem of PBAK acrylate type in adhesive
Problem Phenomenon
Polybutyl acrylate-type PBAK exhibited blistering during adhesive processing at 80-150°C.
Cause Analysis
Improper Tg design of PBAK caused the problem.
Solution
Control crosslinking.
Key Takeaway
PBAK for coating and adhesive applications requires fine formulation design.
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