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Injection Molding 4 Aufrufe

MP severe internal stress concentration

Problembeschreibung
MP product internal stress >15MPa causing cracking during storage
Ursachenanalyse
injection speed too fast, orientation stress large; uneven cooling freezes thermal stress; improper gate position, flow orientation concentrated
Lösung
1) reduce injection speed to reduce orientation; 2) uniform mold temperature to reduce thermal stress; 3) anneal at 80°C/4h to release stress; 4) optimize gate position
Wichtigste Erkenntnis
internal stress is caused by fast injection and uneven cooling; reducing speed, uniform cooling and annealing are key
MP internal stress orientation stress annealing uniform cooling

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