Production & Quality
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Stress Cracking of PC Products
Problembeschreibung
Cracks appear in PC products during use or storage, especially when contacting chemicals.
Ursachenanalyse
PC is sensitive to environmental and solvent stress cracking (ESC); large molding internal stress plus chemical contact (such as oil, solvents, alkali) initiates cracks.
Lösung
Increase the mold temperature to 80-120°C to reduce internal stress; anneal at 120°C/1-2h; avoid contact with sensitive chemicals.
Wichtigste Erkenntnis
PC stress cracking is the core problem affecting service life.
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