Production & Quality
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Stress Cracking of PC Products
Fenómeno del problema
Cracks appear in PC products during use or storage, especially when contacting chemicals.
Análisis de la causa
PC is sensitive to environmental and solvent stress cracking (ESC); large molding internal stress plus chemical contact (such as oil, solvents, alkali) initiates cracks.
Solución
Increase the mold temperature to 80-120°C to reduce internal stress; anneal at 120°C/1-2h; avoid contact with sensitive chemicals.
Conclusión clave
PC stress cracking is the core problem affecting service life.
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