Production & Quality
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Stress Cracking of PC Products
Problem Phenomenon
Cracks appear in PC products during use or storage, especially when contacting chemicals.
Cause Analysis
PC is sensitive to environmental and solvent stress cracking (ESC); large molding internal stress plus chemical contact (such as oil, solvents, alkali) initiates cracks.
Solution
Increase the mold temperature to 80-120°C to reduce internal stress; anneal at 120°C/1-2h; avoid contact with sensitive chemicals.
Key Takeaway
PC stress cracking is the core problem affecting service life.
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