Production & Quality
6 مشاهدة
Stress Cracking of PC Products
ظاهرة المشكلة
Cracks appear in PC products during use or storage, especially when contacting chemicals.
تحليل الأسباب
PC is sensitive to environmental and solvent stress cracking (ESC); large molding internal stress plus chemical contact (such as oil, solvents, alkali) initiates cracks.
الحل
Increase the mold temperature to 80-120°C to reduce internal stress; anneal at 120°C/1-2h; avoid contact with sensitive chemicals.
الخلاصة الأساسية
PC stress cracking is the core problem affecting service life.
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