Molding Process
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PA6 Warpage
Fenómeno del problema
Product warpage deformation, obvious on flat parts, with uneven assembly gaps.
Análisis de la causa
PA6 shrinkage is 1.5%~2.5% and the difference between flow/transverse shrinkage is large; uneven cooling, improper holding pressure, and differential shrinkage caused by molecular orientation all cause warpage; the anisotropy of crystalline materials is the root cause.
Solución
①Balance mold temperature (separate-circuit temperature control) to reduce temperature difference;②optimize the holding pressure curve, taking into account both compensation and internal stress;③optimize wall thickness uniformity to reduce differential shrinkage;④constrain flat parts with setting fixtures after demolding;⑤optimize gate position to improve material flow and confluence.
Conclusión clave
PA6 warpage = 'high shrinkage + orientation': setting fixtures are a sharp tool; warpage of crystalline materials requires balancing mold temperature, restraining holding pressure, and constraining setting in three ways, and the setting constraint after demolding is especially effective.
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