Molds & Tooling
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PC Internal Stress Cracking
Fenómeno del problema
[Problem Phenomenon] PC products crack after storage or assembly, caused by internal stress
Análisis de la causa
PC's rigid molecular chains make internal stress difficult to eliminate; low mold temperature, high holding pressure, uneven cooling and wall thickness transitions all aggravate it; internal stress is released and cracks under solvents or loads; when troubleshooting on site, verify each item according to this mechanism one by one, and avoid blindly adjusting the machine based on experience alone
Solución
High mold temperature and low holding pressure to reduce stress; uniform wall thickness; annealing to relieve stress; polariscope stress detection; after adjustment, take samples continuously to verify the effect, and resume mass production only after confirming stability; change only one variable at a time and record parameter changes, so as to locate effective measures
Conclusión clave
PC internal stress is the culprit of cracking; high mold temperature, annealing and polariscope detection; after confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence; include this case in the defect archive as a reference for troubleshooting similar problems in the future
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