Molding Process
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Poor Insert Bonding of PEEK
Fenómeno del problema
The interface bonding strength of PEEK metal insert products is low, the insert loosening pull-out force is unqualified, and the interface cracks and fails after thermal cycling.
Análisis de la causa
The thermal expansion coefficient difference between metal and PEEK is large, and cooling shrinkage produces interface gaps or stress; when the insert surface condition and preheating temperature are insufficient, the melt wets and covers poorly.
Solución
①Preheat inserts to near the mold temperature to reduce temperature-difference stress; ②Knurl the insert surface or use a structural interlock design; ③Control holding pressure to avoid interface overstress; ④Verify interface reliability with thermal cycling tests.
Conclusión clave
The core contradiction of PEEK insert parts is thermal expansion mismatch; preheating and mechanical interlock are the two basic means; interface verification must include temperature cycling conditions.; After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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