Molding Process
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Poor Insert Bonding of PEEK
Problem Phenomenon
The interface bonding strength of PEEK metal insert products is low, the insert loosening pull-out force is unqualified, and the interface cracks and fails after thermal cycling.
Cause Analysis
The thermal expansion coefficient difference between metal and PEEK is large, and cooling shrinkage produces interface gaps or stress; when the insert surface condition and preheating temperature are insufficient, the melt wets and covers poorly.
Solution
①Preheat inserts to near the mold temperature to reduce temperature-difference stress; ②Knurl the insert surface or use a structural interlock design; ③Control holding pressure to avoid interface overstress; ④Verify interface reliability with thermal cycling tests.
Key Takeaway
The core contradiction of PEEK insert parts is thermal expansion mismatch; preheating and mechanical interlock are the two basic means; interface verification must include temperature cycling conditions.; After confirming effectiveness, solidify the parameters and practices into the work instruction to prevent recurrence
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