Material Drying
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PLA Deep Dehumidification 85℃
Problem Phenomenon
After ordinary drying, PLA extrusion still has filament breakage and bubbles, and the moisture content test still exceeds the standard
Cause Analysis
Deep moisture in PLA requires low dew point and long dehumidification: fine-denier fiber standards require 85±0.5℃, dew point ≤-55℃, and 4 hours of residence, only then can the moisture content be pressed below 30ppm
Solution
①For high-requirement processes use 85℃×4h, dew point ≤-55℃ deep dehumidification; ②Dual molecular sieve rotor redundant configuration; ③Microwave moisture meter real-time feedback; after adjustment, take continuous samples to verify the effect, and resume mass production only after confirming stability
Key Takeaway
Drying for high-requirement PLA processing is system engineering; dew point -55℃ plus 4 hours of residence is the equipment guarantee for ppm-level moisture; after confirming effectiveness, fix the parameters and practices into the work instruction to prevent recurrence
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