Injection Molding
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Stress Concentration in the Gate Area of PBT Injection-Molded Parts
Problem Phenomenon
The stress in the gate area of the product is high, which is obvious under polarized light.
Cause Analysis
The temperature gradient and flow history of the gate area are different; the molecular chain orientation in this area is high, the cooling is fast, and the internal stress is large.
Solution
Use a larger gate to reduce the shear and orientation in this area; increase the mold temperature in this area; anneal.
Key Takeaway
The PBT gate area is an internal stress concentration area.
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